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1·The snap curing oven is key equipment in the semiconductor packaging.

半导体封装快速养护炉是半导体封装过程中的一个关键设备。

2·The die bonding requires the temperature field of the oven to be even, but an existing curing oven can not suit the requirement.

半导体封装粘结工艺养护过程要求炉内温度均匀分布，现有养护炉不能满足这一要求。

3·It is very important to find the reasons of the oven defects through theory analysis of the temperature field of the curing oven.

对养护过程炉内温度场进行理论分析，对于正确认识现有养护炉存在缺陷的原因具有重要的意义。

4·This article makes a detailed description on the improved design of the key equipment-curing oven in the coating production line.

本文对涂装生产线中的关键设备—固化设备的改进设计做了较为详细的论述。

5·A brief analysis is given of the vertical radiant curing oven drying system with oil-heated air circulation and water-cooled air curtain used for manufacturing impregnated glassfibre fabrics.

简要分析覆铜板芯布立式干燥系统组成和原理、辐射板干燥及其气流加热循环、气帘冷却循环等技术。

6·Convection Oven systems utilize heated air to process a variety of products for drying and curing.

对流烤箱系统利用热空气干燥和硫化各种产品。