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1·In this paper we report the analysis of underfill encapsulation between the solder ball, micro-chip...

文中主要探讨了覆晶封装底胶充填时，锡球、芯片及基板间的流动状况。

2·The first underfill is filled between the first chip and the second chip in order to wrap the first bump.

以及第一底胶，填充在所述第一芯片与所述第二芯片之间，且包覆所述第一凸块；

3·Underfill technology effectively enhances the flip-chip cycle fatigue life and reliability of packaging process.

基 板上的倒装芯片一般采用底部填充技术以提高其封装的可靠性。

4·The die cracking with no-flow underfill is analyzed and compared with the case for conventional capillary-flow underfill.

用断裂力学方法和有限元模拟分析了填充不流动胶芯片断裂问题。

5·Engineers can optimize via design using ANSYS tools, identifying and resolving the effects of coating and underfill materials.

工程师可以使用ANSYS工具优化设计、识别和解决涂层和填充材料的影响。

6·Through non-linear finite analysis , the dependence of fatigue life of solder joint on thermomechanical properties of underfill was calculated.

通过非线性有限元分析，计算出焊点疲劳寿命对下部填充料基本热力学性质的依赖关系。

7·As the density for mobile electronic product becomes higher and higher and underfill technology improved, more and more underfill material have been developed.

随着移动电子产品的密度越来越高，底层填充技术逐步提高，越来越多的底层填充材料被研发。