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1·Joints between reinforcement members can be made satisfactorily with tin solder.

锡焊能够满意地做成加筋构件之间的接头。

2·We have determined tin and lead contents in tin solder using the XRF fundamental parameter method without standard sample in this paper.

本文在无标样的情况下，用X射线荧光基本参数法测定了焊锡中的锡和铅的含量。

3·The method is proved to be accurate, reliable, convenient and quick, absolutely suitable for the assaying of trace lead in silver tin solder.

方法准确、可靠、简便、快速，完全适用于银锡焊料中微量铅的检验。

4·The paper introduces the laser cut mould plate, the characteristics of tin solder and some problems which should be paid attention to in screen printing.

重点介绍了激光切割成型的模版、锡焊膏的特点及丝网印刷中应注意的问题。

5·The key factor is the proper amount of tin solder to be screen printed onto welded surface of PCB. To do this well, it's necessary to control several technological factors.

丝网印刷在双面印年刷电路板（ PCB）工艺中起着重要作用，最关键的环节是要掌握好网印到PCB焊盘上锡焊膏的量，要做到这一点，需要综合控制好多种工艺因素。

6·The process is directly between the two types of metal welding, a solid solder joint appearance, there is no brittle fracture caused by tin solder, oxidation, solder false.

该工艺是两种金属之间直接熔接，焊点美观牢固，没有锡焊引起的脆裂、氧化、虚焊、假焊。

7·All foot machine, automatic machine PC board feet cut, cut legs pushing machines manually solder equipment, hand Baptist tin stoves, printer, Tool Grinder.

切脚机，自动P C板切脚机，手推切脚机，手动焊锡设备，手浸锡炉，印刷机，磨刀机。

8·Max lay traps the traps of tin colonel sent CARDS and boarded a tanker killer, but being caught brought to the card before solder colonel.

马克斯设圈套诱杀了卡锡上校派来的杀手，登上了油轮，但却被抓住带到了卡锡上校面前。

9·The main products are: solder wire, lead-free solder bar, line, lead-free solder paste, strips, tin ingots, flux, electroplating anode, babbitt, etc.

主要产品有：焊锡丝、焊锡条、无铅锡线、无铅锡条、锡膏、锡锭、助焊剂、电镀阳极棒、巴氏合金等。

10·A new stripper for removing the solder from the surface of waste printed circuit boards was developed on the basis of a nitric acid - sulfonic acid type tin stripper.

以硝酸-磺酸型退锡剂为基础配方，研制了一种脱除废旧电路板表面残留焊锡的剥离液。

焊锡

1·We have determined tin and lead contents in tin solder using the XRF fundamental parameter method without standard sample in this paper.

本文在无标样的情况下，用X射线荧光基本参数法测定了焊锡中的锡和铅的含量。