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1·The method is proved to be accurate, reliable, convenient and quick, absolutely suitable for the assaying of trace lead in silver tin solder.

方法准确、可靠、简便、快速，完全适用于银锡焊料中微量铅的检验。

2·The main products are: solder wire, lead-free solder bar, line, lead-free solder paste, strips, tin ingots, flux, electroplating anode, babbitt, etc.

主要产品有：焊锡丝、焊锡条、无铅锡线、无铅锡条、锡膏、锡锭、助焊剂、电镀阳极棒、巴氏合金等。

3·The shear strength of BGA joint with eutectic solder is higher than that of tin-lead alloy itself.

共晶钎料BGA球焊点的抗剪强度比锡铅合金钎料自身的抗剪强度大。

4·We have determined tin and lead contents in tin solder using the XRF fundamental parameter method without standard sample in this paper.

本文在无标样的情况下，用X射线荧光基本参数法测定了焊锡中的锡和铅的含量。

5·Recycling waste tin material: lead-free solder recovery and recycling, tin tin slag the recycling, tin line recovery, solder paste recycling waste tin tin ash, such as waste lead recovery.

回收废锡料：无铅焊锡回收、锡渣回收、锡条回收、锡线回收、锡膏回收、锡灰等废锡废铅回收。

6·The effects of X content on the conductivity, thermal conductivity, tin melting rate, dryness, and other physical properties of the new lead-free solder were studied.

研究了X含量对新型无铅焊料的导电性、导热性、熔锡速度和干燥度等物理性能的影响。

7·The apparatus (1) enables copper which has dissolved in a lead-free solder comprising tin as the main ingredient to precipitate as an intermetallic compound to separate the copper.

该装置(1)可使溶出于包含以锡作为主成分的无铅焊料中的铜作为金属间化合物析出以分离铜。