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1·A new electroplating technology of solderable bright Sn-Sb alloy of bath components and operating conditions were studied.

研究了一种新型可焊性光亮锡锑合金电镀工艺的镀液配方和电镀操作条件；

2·A uniform, compact, bright lustre, good adhosive and excellent solderable coating was obtained by the experimental electroplating.

经小槽电镀，获得外观致密均匀，似镜面光亮，结合力强，具有优良的可焊性镀层。

3·You can omit the thermal reliefs when the plane is quite small, but be careful because the pin may be hardly solderable if the plane is too large.

在电镀面很小时也可以不用限热槽，但是电镀面很大时就需要小心，因为此时不容易焊接。

4·The places to which components will be mounted are typically plated, because bare copper oxidizes quickly, and therefore is not readily solderable.

在组件将会安装通常镀铜，因为生氧化快，因此不容易电镀面很大。

5·When solder bumps (22) on the die are reflowed, the fluxing agent ACTS to remove any oxides present on the solderable surfaces of the substrate or the die.

当管芯上的焊料突点(22)被回流时，该助焊剂的作用是清除基板或管芯的可焊接表面上存在的任何氧化物。

6·The silver paste series is external electrode solderable silver paste, widely applied to electronic ceramic parts, which has good welding adaptability after.

本系列银浆为外部电极可焊银浆，广泛应用电子陶瓷元件，烧结后具有良好的焊接适应性。