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1·A three-dimensional model for transient thermal profile in a finite laser rod is presented.

本文建立了有限几何尺寸棒状激光介质瞬态热分布的三维模型。

2·DTS provides a thermal profile, tracking temperature response over time to evaluate real-time fluid distribution across the entire well.

DTS提供温度剖面，实时跟踪温度数据，用以评估整个井筒的流体分布情况。

3·Photoacoustic phase shows the special ability of measuring the optical and thermal properties, studying the nonradiative relaxation processes and analyzing the depth profile of the sample and so on.

光声位相在测定样品的光学和热学性质、样品无辐射弛豫过程的研究以及深度剖面分析等方面显示了特有的能力。

4·Comprehensive researches of the downhole thermocouple temperature log data reveal the thermal interconnecting characteristics between Wells and the distribution of steam on profile.

通过对井下热电偶测温技术的综合研究，揭示了特浅层超稠油油藏井间热连通特征及蒸汽在剖面上的分布状态。

5·During the drying process of MV, for the whole board, the effect of thermal diffusion on moisture movement is not significant, but it can cause a leveling of moisture profile in a local range of wood.

在微波真空干燥过程中，就整个板材而言，热扩散效应对木材中水分迁移的影响不大，但在局部的有限范围内，它对自动平衡木材内含水率具有显著的作用。

6·By thermal comfort index PMV, the thermal comfort ratio of the specific profile at each berth is only 42%.

采用人体热舒适性指标PM V得出特征断面上各铺位上达到热舒适标准的测试点仅为42%。

7·The effect of rapid thermal processing (RTP) on oxygen precipitates profile and denude zone (DZ) in Czochralski (CZ) silicon wafer during simulating CMOS processing is investigated.

本文研究了快速热处理工艺(RTP)在模拟的CMOS热处理工艺中对直拉硅单晶中氧沉淀和洁净区(DZ)的影响。

8·The effect of vacuum thermal cycles on the linear expansion coefficient profile was analyzed using a proposed two-dimensional model of micro-damage.

通过所建二维细观损伤模型分析了真空热循环次数对材料线膨胀系数曲线影响的原因。

9·Experiments were designed and conducted on spacecraft thermal coating to simulate an absorbed dose profile from synchronous altitude radiation by varying the energy of incident electrons and protons.

文章介绍了航天器的热控涂层试验，用改变入射质子和电子能量的办法，模拟同步轨道辐射环境。

10·A new model of thermal contact resistance based on the statistic characteristic of roughness profile is proposed in this paper.

本文在对粗糙度曲线统计特征分析的基础上，提出了一种接触热阻的计算模型。