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1·The gas outlet holes (74, 75) and gas channels (70, 80) are configured to support a wafer using the Bernoulli principle.

气体出口孔(74,75)和气体通道(70,80)被配置以便利用伯努利定理支撑晶片。

2·The pressure differential generates a lift force that supports the wafer below the head portion (54) of the wand in a substantially non-contacting manner, employing the Bernoulli principle.

该压力差生成以基本非接触的方式支撑该棒的 头部部分（54）下面的晶片的抬升力，其采用了伯努利定理。