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1·Polyimide film has excellent performance, so it was widely used in various fields.

聚酰亚胺薄膜性能优异，广泛应用于各种领域。

2·Polyimide film has been the ideal flexible substrate for its physical and chemical performance.

聚酰亚胺薄膜由于其良好的物理化学性能，成为柔性衬底的理想材料。

3·The production technology, applications and product prices of polyimide film were overviewed in this article.

综述了我国聚酰亚胺薄膜的生产技术、应用以及产品价格。

4·Method for preparing 1, 4-di (2, 4-diamino phenoxy) benzenoid form polyimide film for flexible copper clad plate.

柔性覆铜板用1,4 -双(2,4 -二氨基苯氧基)苯型聚酰亚胺薄膜的制备方法。

5·The changes of structure and its effect on performance of polyimide film have been studied at different carbonization temperature.

研究了聚酰亚胺薄膜在不同碳化温度下，材料内部结构转变规律及其对材料性能的影响。

6·The measuring grid is formed by etching Constantan foil, which is then completely sealed in a carrier medium composed of polyimide film.

测量网格是由康铜箔片构成的，然后完全密封于一个由聚酰亚胺薄膜组成的介质载体。

7·The tensile strength of polyimide film will also be affected by the temperature of de-solvent and the heating way of thermal imidization.

不同的去溶剂温度和热亚胺化的升温方式对聚酰亚胺薄膜拉伸强度也有较大的影响。

8·The invention relates to a metal cross-linked polyamide acid, the metal cross-linked polyimide, its system of law and the polyimide film.

本发明涉及交联的含金属的聚酰胺酸、交联的含金属的聚酰亚胺、其制法及聚酰亚胺膜。

9·Base materials for printed circuits. Part 2: Specifications. Specification No. 13: Flexible copper-clad polyimide film, general purpose grade.

印制电路用基材。第2部分：规范。第13号规范：通用级软覆铜聚酰亚胺薄膜，通用级。

10·Base materials for printed circuits. part 2: specifications. specification no 15: flexible copper - clad polyimide film, of defined flammability.

印刷电路用基材。第2部分：规范。15号规范：规定易燃性的包铜软聚酰亚胺薄膜。