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1·The third bonding wire is electrically connected between the second chip and the loader.

第三焊线电性连接于第二芯片与承载器之间。

2·The RF characteristics of bonding wire interconnection in a simple package model were simulated.

针对一种用键合线连接的简单封装模型进行射频性能的模拟。

3·The second bonding wire is electrically connected between the relay circuit base board and the loader.

第二焊线电性连接于中继线路基板与承载器之间。

4·The first bonding wire is electrically connected between the first chip and the relay circuit base board.

第一焊线电性连接第一芯片与中继线路基板之间。

5·Should first bonding wire brush to remove sediment from the bottom surface, and then immediately sprayed coating job.

应先用钢丝刷刷去除粘结底层表面的沉积物，然后立即喷涂工作涂层。

6·The content and focus of the project is based on the research and analysis of the present condition of internal and external golden bonding wire production.

我们在对国内外的键合金丝生产及研究现状进行详细分析与研究之后，确立了项目的研究内容并提出了项目的预期目标。

7·Wire bonding is a critical technique for realizing microwave hybrid circuit.

引线键合是实现微波混合电路的关键技术。

8·Gas plasma technology can be used to clean pads prior to wire bonding to improve bond strengths and yields.

气体等离子技术能够用于在引线键合前清洗焊盘以改进键合强度和成品率。

9·Its comprehensive coverage focuses on printed circuits, integrated circuits, contact materials, semiconductors, wire, bonding, brazing, soldering, and welding.

它的广泛报导集中在印刷电路、集成电路、连接材料、半导体、导线、粘结、钎焊、焊锡和焊接。

10·From the view of wire bonding, the whole procedure consists of two states: the free motion and the constrained motion.

从引线键合运动的角度来说，完整过程包括两种不同的运动状态：自由运动和约束运动。