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1·It is a real green and environment protective bonding material.

属绿色环保型铸造材料。

2·Selection of the underlying bonding material generally chromium iron-nickel alloy.

粘接底层材料一般选用铬铁镍合金。

3·The present invention relates to a bonding material for shoemaking industry and its preparation method.

本发明涉及制鞋行业所需的粘接材料及其制备方法。

4·The viscoelasticity and viscoplasticity of bonding material will result in hysteresis and drift errors to sensor output.

黏合材料的黏弹性和黏塑性将会导致传感器输出的滞后和漂移误差。

5·Bonding material of aluminum and copper is useful material concerning lightening, and thermal and electrical conductivity.

粘结材料的铝和铜是关于减轻了有用的材料，和热和电导率。

6·The insufficient shear strength of waterproof bonding material will result in the jostle, piling up, wave and rut of facing layer.

防水粘结材料抗剪强度不足会导致面层推挤、拥包、波浪和车辙的产生。

7·The rubber asphalt mixture is an asphalt mixture by taking the rubber asphalt as the bonding material to be heated and mixed with the aggregates.

橡胶沥青混合料是指采用橡胶沥青作为结合料与集料加热拌和而得到的一种沥青混合料。

8·The bonding material and the protective layer may affect the desired index of refraction of the material on either side of the wavelength converting element 110.

粘合材料与保护层可能会影响在波长转换元件110的任一侧上的材料的所期望的折射率。

9·Primer, a bonding material is used when making the heat fusion road markings. The prime can prevent the film from coming off and strengthen the adhesive force between the film and the road surface.

底漆是涂布路面标线用热熔涂料时使用的粘结材料，底漆起着防止涂膜剥落，提高涂膜和路面粘着力的作用。

10·Direct wafer bonding is a new process of material integrating and has received tremendous attention in the research of optoelectronics and microelectronics field.

摘要晶片直接键合技术是材料集成的一项新工艺，是近年来集成光电子领域的研究热点之一。