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1·They can be classified into wafer level, chip level, and package level stacking.

它们可以分为圆片级封装、芯片级封装、和封装面。

2·This paper discusses a true wafer level packaging (WLP) technology which is called Ultra CSPTM.

文章论述了超csptm圆片级封装技术工艺。

3·The device's WLCSP (Wafer Level Chip Scale Package) is ultra compact, simplifying board design.

该器件的WLCSP(晶圆级芯片尺寸封装)是超小型，简化电路板设计。

4·This wafer level chip size package (WL-CSP) process encases the die in a solid die-size glass shell.

圆片级芯片尺寸封装（WL-CSP）工艺是在固态芯片尺寸玻璃外壳中装入芯片。

5·The part is available in a 32-lead lead frame chip scale package (LFCSP), and a 25-ball wafer level chip scale package (WLCSP).

该器件提供两种封装：32引脚架构芯片级封装（LFCSP）和25引脚晶圆级芯片规模封装（WLCSP）。

6·Other typical low current measurements on wafer level semiconductors are related to the dielectric, either the oxide or compound quality.

另一些对于晶圆片级半导体的弱电流测量则通常与介电材料(氧化物或化合物)的质量有关。

7·This paper introduces the background of using Wafer Level Reliability technology, and expounds the characteristics and functions in details.

介绍了圆片级可靠性技术产生的背景，对其特点和作用作了详细的论述。

8·Electrostatic bonding is an important encapsulating means for the materials at the chip or wafer level. Reactions and bonding between glasses in an electric field were discussed in this paper.

静电键合是片状材料封接的一种重要手段，讨论了玻璃在电场作用下的键合过程。

9·The difination, evolution, status and supporting technologies of wafer-level packaging are introduced and reviewed in this paper.

本文对圆片级封装的定义、演变、进展状况及支撑技术进行了介绍和分析评论。

10·The WLP technology that initiates processing from Wafer-Level and finishes in chip scale will be applicable on a daily broadening scale in plane array FCP.

在圆片规模上开始加工，结束于芯片规模的圆片级封装技术将在面型阵列倒装芯片的封装中得到日益广泛的应用。