全部

1·The parameters deciding the quality in polishing process are as follows: slurry, temperature, wafering time, and so on.

抛光过程中决定抛光质量的参数有：抛光浆体、抛光温度、抛光时间等。

2·Thirdly, the parameters deciding the quality in polishing process are as follows: slurry, polish pad, pressure, temperature, rotation speed, wafering time, and so on.

在抛光工艺中，抛光液的种类、抛光垫的选择、抛光压力、温度、抛光盘转速、加工时间等诸多条件都是决定抛光质量的重要因素。

(1)silicon wafer硅片

(1)semiconductor wafer半导体薄片

(1)circuit wafer电路板