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1·Tin plating on Solder Tail.

的锡焊尾，电镀。

2·Tin Plating on Solder Tail, Harpoon: Brass.

电镀锡焊尾，鱼叉：黄铜。

3·The mechanism of electroless tin plating was discussed.

对化学镀锡的机理做了探讨。

4·Pretreatment, silver plating, nickel plating and tin plating of chip components.

应用于片式元器件的前处理、镀银、镀镍、镀锡等工艺。

5·Contact plating: Gold plating over Nickel on contact area tin plating on solder tail.

触点电镀：镀镍金的接触面积的锡焊尾电镀。

6·The process of electroless tin plating has wide applications in microelectronic filed.

化学镀锡工艺在微电子行业具有很好的应用前景。

7·The invention relates to a piston ring and a surface spongy tin plating technique thereof.

一种活塞环及其表面松孔镀锡工艺。

8·Understand Tin plating theory and process; understand chemical de-flash theory and process;

了解电镀原理，制程；了解化学去溢料原理，制程。

9·The research tendency and developing prospect of electroless tin plating are also discussed.

同时对化学镀锡的研究方向和发展趋势进行展望。

10·Operating hints and safety requirement of re melting in crystal pattern tin plating were introduced.

介绍了晶纹镀锡中重熔工序的操作要点和安全要求。