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1·Flyers that have tackled this issue claim that a copper foil shield around the camera is an easy remedy.

已经解决了这个问题，传单宣称相机周围的铜箔屏蔽是一个简单的补救措施。

2·The alloy coating obtained is used as the barrier layer of wrought rolled copper foil in PCB manufacturing.

该锌-镍合金作为印制板用压延铜箔的阻挡层。

3·Other thicknesses are also available upon request. All the thicknesses were included copper foil thicknesses.

其它厚度和尺寸也可以提供。以上厚度包括铜皮厚度。

4·Through precise control of welding process parameters, one-side welding enameled wire to copper foil is realized.

通过对焊接工艺参数进行精密控制，实现了铜箔漆包线的单面直接焊接。

5·The present invention discloses one low roughening treatment process for the surface of electrolytic copper foil.

本发明公开了一种对电解铜箔的表面进行低粗化的处理方法。

6·The technical measures to improve roughness copper foil and strengthen dispersion of carbon black were introduced.

介绍了提高铜箔粗化度及加强碳黑分散的工艺措施。

7·The paper dynamically analyses copper Foil tension of the Crude Foil Engine in the copper Foil production progress.

对生箔机在铜箔生产过程中的铜箔张力进行动态分析，揭示出转矩、铜箔张力、实时卷绕半径之间的关系。

8·A copper foil solution is used to bond the glass pieces together, and then the pieces are soldered together firmly.

铜箔解决方案可使玻璃碎片结合在一起，然后一起焊接牢固。

9·Various insulating materials as electronic shield materials, PVC, film, Mylar , copper foil . aluminum foil, foam, ect.

电子屏蔽材料、 PVC 、 胶片、麦拉纸、 铜箔、铝箔、 泡棉等多种绝缘材料。

10·After the plating, corrosion resistance, heat resistance and binding strength of electrolyte copper foil were improved.

经过处理后的电解铜箔耐蚀性、耐热性和粘合强度等性能指标均有明显提高。

铜箔

1·The resistance of the copper rate is low, so in printed circuit board, used to prepare copper foil and double panel, produce multilayer prototypes via metallization copper with on the process.

金属铜的电阻率低，所以在印制电路板中，用来制备铜箔及双面板、多层板的孔金属化方面采用镀铜工艺。

2·The ideal formula of the adhesive is determined by series of experiments and the reaction process and thermal stability of copper foil adhesives are studied by te, TGA and DTA.

通过一系列研究确定了胶粘剂的理想配方，并通过红外光谱、热失重和差热分析法对其铜箔胶粘剂的反应过程和热稳定性进行了探讨。

3·After the plating, corrosion resistance, heat resistance and binding strength of electrolyte copper foil were improved.

经过处理后的电解铜箔耐蚀性、耐热性和粘合强度等性能指标均有明显提高。

4·The influence of copper foil surface quality on electrical performance of power transformer is analyzed, the key technology for monitoring the surface flaw with machine vision system is studied.

分析铜箔表面质量缺陷对电力变压器电气性能的影响，研究采用机器视觉系统对铜箔表面质量缺陷监视的关键技术。

5·The copper foil board base paper is the fundamental material to product the paper of printing line board, and also is a kind of higher degree special industrial paper.

覆铜箔层压板原纸是生产印刷线路板用全纸基覆铜箔层压板的基础材料，是一种生产难度较高的特种工业用纸。