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1·Tessera still owns patents for chip packaging that enable electronics miniaturization.

Tessera还拥有实现电子设备小型化的芯片封装专利。

2·Manufacturing engineer and manager review and approve Mould Block Purchasing Order and Big Tessera Steel Purchasing Order.

制造工程师和制作部经理则分别在<模胚订购清单>和<大肉钢材订购单>审核、批准；

3·It has signed two large power-purchase agreements, for up to 1,750MW, and plans to fulfil them using dish-engine systems built in conjunction with its sister company, Tessera Solar.

它已经签定了两项大型的高达17500亿瓦的能源购买协议，并计划通过运用和它姊妹公司Tessera共同打造的盘式发动机系统来实现协议的内容。