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1·Two lead frame (strip) vertical or parallel loading function.

双导引结构，垂直或水平装载功能。

2·Gold, silver and nickel plating of IC lead frame and package shell.

集成电路引线框架、封装壳体的镀金、镀银、镀镍、镀锡工艺。

3·In particular insulation on the lead frame wood attention should be paid.

特别对引线支架木块的绝缘应引起重视。

4·The invention provides a lead frame and packaging of a semiconductor device.

本发明提供一种半导体器件的引线框及封装。

5·The copper alloy strip of lead frame is the fundamental material for integrate circuit.

引线框架用铜带是集成电路的重要基础材料。

6·This results that the lead frame and the detection element have improved electrical connection.

这导致引线框架和检测元件 之间的具有改善的电连接状态。

7·This paper discusses the methods for improving surface characters of semiconduc-tive lead frame.

研究探讨了改善半导体引线框架材料表面特性的方法。

8·The punching process of the lead frame was analyzed, the multi-position progressive die was designed.

分析了引线框的冲压工艺性，设计出了多工位级进模。

9·Die Bonder is manufacturing equipment which binds IC chip onto Lead Frame in semiconductor production.

机是用于将IC芯片粘结到引线框架的半导体器件生产专用装备。

10·IC Die Bonder is key equipment which binds semiconductor microchip onto Lead Frame in semiconductor back-end production.

集成电路粘片机是将半导体晶圆上微芯片贴装到引线基架的半导体制造后工序关键性生产设备。