全部

1·As the demand increasing steadily for small volume, high density and high heat-dissipation rate IC, the key parameter of wire bonding — pad pitch has to shrink in accordance.

由于市场对小体积、高集成度和高散热率芯片的需求量与日俱增，引线键合工艺的关键参数——焊盘间距也不断缩小以满足市场要求。

2·The area and shape of a hysteresis loop for the same composite wire vary with the twist pitch.

对于同一种复合线，(辶回)线的形状和面积随扭距而变化。